
Shuttleline® Platform PECVD Supports Thin-Film Processing
Shuttleline platform supporting advanced research applications

Shuttleline platform supporting advanced research applications

Advanced Packaging for US Market – CHIPS ACT Microelectronics Commons NORDTECH Hub

Advancing Scientific Discovery and Technological Innovation St. Petersburg, FL, June 3, 2024

Plasma Dicing for Advanced Packaging May 29, 2024, Plasma-Therm LLC, a leading

St. Petersburg, FL January 19th, 2024 – Plasma-Therm, a supplier of wafer

ST. PETERSBURG, Fla. Sept. 19, 2023 – Plasma-Therm, a leading manufacturer of

As we begin 2026, Plasma-Therm® reflects on a year of innovation, growth, and expanding global presence in 2025. Our technologies and partnerships have empowered customers and research institutions to advance semiconductor and healthcare applications, supporting breakthroughs and enabling the next generation of devices.

What do microns, nanometers, and angstroms all have in common? They are

Customers have once again singled out Plasma-Therm as one of the industry’s

Today’s information age requires moving and manipulating vast amounts of data at

Plasma-Therm® now offers the Tegal™ Diode Reactive Ion Etching (RIE) systems. The

Plasma-Therm had the pleasure of interviewing Ron Olson, Director of Operations at
©2026 THIN FILM EQUIPMENT A Plasma-Therm Company. All Rights Reserved.